高频通讯pcb-深圳市科世佳集成电子有限公司

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高频通讯pcb

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高频通讯pcb层数: 16L

板厚: 1.6mm

外层铜厚: H OZ

内层铜厚: H OZ

最小孔径: 0.15mm

最小线宽/线距: 3mil

表面处理：沉金

产品用途: 通讯主板

工艺难点：高多层

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