高频通讯电路板-深圳市科世佳集成电子有限公司

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高频通讯电路板

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高频通讯电路板层数: 12L

板厚: 2.0mm

外层铜厚: 1 OZ

内层铜厚: 1 OZ

最小孔径: 0.25mm

最小线宽/线距: 4mil

表面处理: 沉金

产品用途：微型基站

工艺难点：高多层

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