半孔模块通讯pcb-深圳市科世佳集成电子有限公司

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半孔模块通讯pcb

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半孔模块通讯pcb类型：FR-4

层数：4层

最小线宽/线距：4mil/4mil

最小孔径：0.20mm

铜厚：1OZ

板厚：0.80mm

工艺类型：沉金

油墨颜色：蓝色

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