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线路板打样层数:8 L
板厚:2.4mm
外层铜厚: 3 OZ
内层铜厚: 2 OZ
最小孔径: 0.25mm
最小线宽/线距: 4mil
表面处理: 沉金
产品用途: 激光器控制板
工艺难点: 金面平整度要高