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8层大金面线路板打样
8层大金面线路板打样
Types of:

线路板打样层数:8 L

板厚:2.4mm  

外层铜厚: 3 OZ

内层铜厚: 2 OZ

最小孔径: 0.25mm

最小线宽/线距: 4mil

表面处理: 沉金

产品用途: 激光器控制板

工艺难点:   金面平整度要高

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